Munich, 11. November 2024 – The Standardization Group for Embedded Technologies (SGET) is excited to announce the official release of OSM (Open Standard Module) Specification 1.2, alongside the newly updated OSM Design Guide 1.1. These new releases are the result of over twelve months of dedicated work by the SDT.05 standardization group, focused on enhancing the existing OSM standard while preserving full compatibility with modules based on Specification 1.1.
Key Upgrades in OSM Specification 1.2
OSM Specification 1.2 introduces several targeted updates that extend the flexibility and functionality of the leading standard for soldered-on modules. The primary focus of this revision has been on expanding and optimizing individual interfaces to offer developers more versatile integration options, including among others:
- Enhanced LVDS Interface
Now available as a single-channel option on Size-S modules, previously exclusive to Size-L, broadening potential applications and compatibility. - Second CSI Interface
Extended compatibility to Size-M modules, allowing for enhanced connectivity across various design sizes. - Second I2S Interface
Both interfaces now available on Size-0 modules
Refined Documentation for Streamlined Implementation
Refinements to the OSM Specification 1.2 documentation improve clarity and readability, thus simplifying the implementation process for developers. Minor adjustments and additional explanations help close any specification gaps, making complex technical requirements more approachable. Complementing these updates, the new OSM Design Guide 1.1 provides expanded guidance, offering detailed insights to support smooth integration and optimal performance across a wide range of applications.
“Releasing OSM Specification 1.2 marks a significant milestone for SGET as we continue to drive innovation in soldered-on module standards,” said Ansgar Hein, Chairman of the Board at SGET. “Our mission is to make these standards increasingly versatile, accessible, and future-ready. We’re proud of our SDT.05 team’s commitment to quality and look forward to seeing the industry leverage these advancements.”
