Semiconductor News
Semiconductor For You brings you the latest semiconductor news from around the world, whether it's the latest advances in electronic or semiconductor components.
SEGGER adds class-leading Arm Helium enhancements to JPEG decode for the Renesas RA8D1 MCU
Monheim am Rhein, Germany – December 12th, 2023 SEGGER has made available hand-optimized extensions to their JPEG decode firmware to...
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Andes Awards Imperas 2023 Partner of the Year
Imperas is honored for its support of Andes customers with Fast Processor Models of the Andes RISC-V processor IP Dr....
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Infineon introduces 12 A and 20 A synchronous buck regulator family with fast COT architecture for DC-DC POL applications
Munich, Germany – 7 December 2023 – Modern power systems require highly efficient and compact regulators. Infineon Technologies AG (FSE:...
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Infineon introduces new CoolMOS™ S7T with integrated temperature sensor
Munich, Germany – 5 December 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its new CoolMOS™ S7T...
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Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition
TOKYO, Japan, November 30, 2023 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced today that...
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SEGGER emWin supports Arduino
SEGGER announces the integration of emWin into the Arduino platform, offering users a seamless way to use emWin in their...
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Nordic-powered sensor detects the presence of methamphetamine in buildings
The P Alert Meth Alarm developed by Technosphere uses a Nordic nRF9160 SiP to send alerts and reports to Cloud...
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Color-Keyed Thru-Hole Mount Test Points
New Hyde Park, NY…Identification of test points in high density PCB packages is the key to greater PCB production testing...
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SEGGER officially supports debugging in Visual Studio Code
Monheim am Rhein, Germany – November 9th, 2023 SEGGER announces its official support for debugging embedded systems in Visual Studio...
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Renesas Announces Plans for Full Automotive SoC, MCU Product Lineup
Future Offerings to Include R-Car SoCs with Advanced In-Package Chiplet Integration Technology and Arm-Based Automotive MCUs TOKYO, Japan, November 7,...
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