Monheim am Rhein, Germany – April 19th, 2023 SEGGER announces embOS and Embedded Studio support for ST's cost-effective STM32C0 MCU...

Munich, Germany – 19 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers power solutions such as...

New SimpleLink™ wireless connectivity devices enable efficient Wi-Fi 6 and Bluetooth® Low Energy 5.3 connections in any environment DALLAS (April...

Munich, Germany, and Taipei, Taiwan – 14 April, 2023 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and Hi-Lo Systems,...

ICULTA Berlin UV LED conference to see high power at short wavelengths and exceptional lifetime Brisbane, Australia, 6 April 2023...

Combine two colours in a single device for cost-effective, dual-colour status indication in displays Easy to integrate and drive; clear...

Ushering in the Next-Generation of Audio GaN power semiconductors are transforming the audio market with superior sounding, higher-performance, smaller, and...

Wireless Microcontroller Integrating Bluetooth® 5.3 Low Energy Employs Most Advanced Process Node Available for MCUs TOKYO, Japan, April 11, 2023...

The latest hardware versions of all commercial SEGGER J-Link models ( J-Link PRO, J-Link ULTRA+, J-Link PLUS, and J-Link BASE)...

The market-share leader in Bluetooth Low Energy extends its commitment to innovation with its new, fourth-generation low power wireless SoCs....