3.1 USB C Plugs & Sockets Save Space & Accelerate Data Transfer
New Hyde Park, NY… Faster data transfer speeds, increased power transmission and smaller PCB footprints are key advantages of the...
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What is Flash Memory: All Explained
Flash memory is secondary memory and is non-volatile, meaning it retains data even without an electrical supply. It operates on...
Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence
Three-year Memorandum of Understanding Supports India's Domestic Technology Growth Strategy While Expanding Renesas' Presence in the Country's Chip Sector TOKYO,...
Geely Auto Gears up NEV Transformation and Innovation with Long-Term SiC Supply Agreement and Joint Lab with STMicroelectronics
ST's third generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles. Innovation Joint...
High Current Rated Load Switches from Diodes Incorporated Provide Smart Power Delivery Solutions for Modern Digital ICs
Plano, Texas – May 28, 2024 – Diodes Incorporated (Nasdaq: DIOD) has announced the expansion of its highly successful DML30xx...
Revolutionary Flip-Chip Die Bonder from ITEC is 5x faster than Current Market Leaders
Nijmegen, The Netherlands, 28.05.2024 - ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than...
Infineon announces roadmap for state-of-the-art and energy-efficient power supply units in AI data centers
Artificial intelligence leads to increasing energy demand of data centers worldwide Infineon’s new Power Supply Units (PSU) strengthen its leading...
CML Micro announces the availability of a complete Digital Radio Mondiale broadcast receiver, making DRM-capable radio more cost-effective and accessible worldwide
20th May 2024 Maldon, Essex - 20 May 2024 - CML Micro has today announced the global availability of the...
Honda and IBM sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity...
Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Munich, Germany – 15 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new XENSIV™ TLE49SR...
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