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New Hyde Park, NY… Press-in type PTFE (Teflon) Insulated Terminals for high temperature and high-quality terminal and connector applications are...

SoftBank Corp. and Fujitsu Strengthen Partnership for Realization of AI-RAN Commercialization

SoftBank Corp. (Note 1) ("SoftBank") and Fujitsu Limited (Note 2) ("Fujitsu") signed a memorandum of understanding on October 25, 2024,...

Murata Expands Combined Gyro and Accelerometer 6DoF Sensor Family with Revolutionary Automotive Solution

Hoofddorp, Netherlands: Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system...

Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs

Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application TOKYO, Japan, November 12, 2024 ― Renesas...

Nexperia’s new 120 V/4 A half-bridge gate driver raises robustness and efficiency in automotive applications

November 12, 2024

Increasing power converter efficiency while also delivering smoother motor control Nijmegen, November 12, 2024: Nexperia today introduced a new series...

Release of updated OSM Specification 1.2 and new Design Guide 1.1

Munich, 11. November 2024 – The Standardization Group for Embedded Technologies (SGET) is excited to announce the official release of OSM...

Renesas and Nidec Announce World’s First 8-in-1 MCU for E-Axle Systems in Electric Cars

New E-Axle Solution to be Showcased in a Live Demonstration at electronica 2024, Munich, Germany from November 12-15 TOKYO, Japan,...

TDK Launches Next-Gen 6-Axis IMUs for Enhanced Driver Assistance and Safety Systems”

SmartAutomotiveTM IAM-20685HP and IAM-20689 are second generation 6-axis MEMS IMUs suited for safety-relevant automotive applications up to ASIL D Compact in size...

TI Introduces Advanced MCUs with Edge AI and Real-Time Control for Enhanced System Performance