Infineon to pilot new AI developer model by Archetype AI
Munich, Germany – 24 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor manufacturer and...
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Infineon opens laboratory for quantum electronics and Power AI
Infineon Technologies AG has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective...
STIWA presents smart lock solution SMALOX based on Infineon’s battery-less NFC lock technology
Munich, Germany and Attnang-Puchheim, Austria – 20 October, 2023 – STIWA Group, a leader in automation and manufacturing technology, will...
Elke Reichart takes over responsibility for Digital Transformation on the Infineon Management Board
Munich, Germany – 19 October, 2023 – The Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) Supervisory Board has appointed...
Nordic cellular IoT-powered modular sensor platform employs harvested solar energy
Brocere Electronics’ Blockcraft IoT Sensor employs the cellular and GNSS capabilities of Nordic’s nRF9160 SiP and the Bluetooth LE connectivity...
Kia Corporation and Infineon sign multi-year supply agreement for power semiconductors
Munich, Germany – 18 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Hyundai Motor Company and...
Infineon introduces its first Qi2 MPP wireless charging transmitter solution at OktoberTech in Silicon Valley
Munich, Germany – 16 October, 2023 – In response to the consumer demand for improved wireless charging user experience, the...
AI Renaissance: 10 Industries Watching out for IESA AI Summit 2023 as it unleashes the Future of AI.
By Mustaqh Ali Shaik, Marketing Manager at MosChip & Core Committee, IESA AI Summit 2023 In today's rapidly evolving technological...
NEC develops 150 GHz Antenna-on-Chip transmitter IC chip for Beyond 5G/6G radio equipment
- Beam steering achieved by integrating antenna elements and phase shifters - TOKYO, Oct 12, 2023 - NEC Corporation (TSE:...
PICMG COM-HPC 1.2 “Mini” Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
95 mm x 70 mm Form Factor COM specification brings low power and high-performance interfaces to drones, mobile robots, and...
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